Optical systems with improved signal to noise ratio

ABSTRACT

Systems and methods for increasing the overall throughput, decreasing the overall background radiation, or a combination thereof for imaging systems.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part of U.S. application Ser. No.16/162,981, entitled OPTICAL SYSTEMS WITH IMPROVED SIGNAL TO NOISERATIO, which is a continuation-in-part of U.S. application Ser. No.15/824,407, filed Nov. 28, 2017, entitled OPTICAL SYSTEMS WITH IMPROVEDSIGNAL TO NOISE RATIO, which claims priority from U.S. ProvisionalPatent Application Ser. No. 62/427,459, filed Nov. 29, 2016, entitledOPTICAL SYSTEMS WITH IMPROVED SIGNAL TO NOISE RATIO, all of which areincorporated herein by reference in their entirety for all purposes.

STATEMENT OF GOVERNMENT INTEREST

This invention was made with U.S. Government support from the U.S. Armyunder contract W909MY-18-C-0040. The U.S. Government has certain rightsin the invention.

BACKGROUND

These teachings relate to optical designs, which provide reducedunwanted background radiation, increased signal throughput, or acombination of both.

As detecting elements become smaller, the size of the associated slitelements in imaging spectrometer designs typically become smaller. Withthis decreased size, the effects of the diffraction of light become moresignificant, leading to the leakage of unwanted background radiationfrom outside the geometric rays to pass through to the detectingelement, as well as leading to the loss of signal radiation that isdiffracted outside of the geometric ray bundle and vignette by theoptical elements or stop of the system.

This effect can be quite significant, particularly in infrared systemswhere unwanted background radiation that is not shielded from thedetecting element can prematurely fill the electron wells of photonicdetecting elements, or mask the true temperature of objects in the scenein the case of pyroelectric detecting elements. In systems whereradiometric sensitivity or accuracy is concerned, the impact of thesediffraction effects can be intolerable.

For example, consider some applications of hyperspectral imaging inwhich it is desirable to have a spectrometer that is intended toidentify targets by their spectral signatures in the infrared portion ofthe electromagnetic spectrum, but must also be very small size and massso that the system can be transported in an unmanned aerial vehicles(UAV) or be man-portable. These sensors may typically have detectingelements and associated slit apertures whose dimensions are on the sameorder as the wavelength of the light they are intended to detect, inwhich case the effects of diffraction are substantial, and can easilyreach diffraction angles of 30 degrees or more. If accurate radiometricmeasurement of the targets is necessary, then this diffraction can maskor hide the target from detection or even introduce false alarmsdetections. Additionally, the loss of wanted signal from the target dueto diffraction can reduce the sensitivity of the sensor, allowingpotential targets and threats to go unidentified.

There is a need for optical designs that increasing the overallthroughput, decrease the overall background radiation, or a combinationthereof.

SUMMARY

The embodiments of the present teachings provide method for increasingthe overall throughput, decreasing the overall background radiation, ora combination thereof for imaging systems.

More specifically, the embodiments disclose and describe an imagingsystem that increases the overall throughput of the system by imaginglight from a given scene that is typically lost due to diffraction incurrent imaging systems. The embodiments further disclose and describean imaging spectrometer system that decreased the overall backgroundradiation in the system by blocking radiation from unwanted sources thatare typically imaged by the system due to diffraction in current imagingsystems.

For a better understanding of the present teachings, together with otherand further objects thereof, reference is made to the accompanyingdrawings and detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a hyperspectral imaging optical system,taken along its optical axis in the plane parallel to the direction ofdispersion;

FIG. 2 illustrates the diffraction of light passing through a slitaperture.

FIG. 3 is a schematic view of the hyperspectral imaging optical systemof FIG. 1, taken along its optical axis in the plane parallel to thedirection of dispersion and illustrating diffraction at the slit;

FIG. 4 is a schematic view of an embodiment of the present teachings,taken along its optical axis in the plane parallel to the direction ofdispersion.

FIG. 5 is a schematic view of the hyperspectral imaging optical systemof FIG. 1, taken along its optical axis in the plane parallel to thedirection of dispersion and illustrating diffraction at the slit;

FIG. 6 is a schematic view of a further embodiment of the presentteachings, taken along its optical axis in the plane parallel to thedirection of dispersion;

FIG. 7 is a schematic view of a hyperspectral imaging optical system,taken along its optical axis in the plane parallel to the direction ofdispersion and illustrating diffraction at the slit;

FIG. 8 is a schematic view of a further embodiment of the presentteachings, taken along its optical axis in the plane parallel to thedirection of dispersion;

FIG. 9 is a schematic view of a further embodiment of the presentteachings, taken along its optical axis in the plane parallel to thedirection of dispersion;

FIG. 10 is a schematic view of a further embodiment of the presentteachings, taken along its optical axis in the plane parallel to thedirection of dispersion;

FIG. 11 is a schematic view of a still further embodiment of the presentteachings, taken along its optical axis in the plane parallel to thedirection of dispersion;

FIG. 12 is a schematic view of a still further embodiment of the presentteachings, taken along its optical axis in the plane parallel to thedirection of dispersion;

FIG. 13 is a schematic view of a still further embodiment of the presentteachings, taken along its optical axis in the plane parallel to thedirection of dispersion;

FIGS. 14A and 14B are isometric views of the imager and diffractionshield components of FIG. 13 taken from the front and rear directionrespectively; and

FIGS. 15A-F are a series of views of a number of the shield elements ofFIG. 13 taken from the rear direction illustrating various beamfootprints.

DETAILED DESCRIPTION

The embodiments of the present teachings provide method for increasingthe overall throughput, decreasing the overall background radiation, ora combination thereof for imaging systems.

By introducing an optical element that blocks or shields unwanteddiffracted background radiation from reaching detecting element, theradiometric accuracy of the sensor can be significantly improved.Additionally, modifications to the optical design of the spectrometercan provide a means to allow a larger portion of the diffracted sceneradiation to pass through to the detecting element unvignetted.

Geometric optics would teach that there is typically only one opticalstop in an optical system, the effects of diffraction at the slitaperture in an imaging spectrometer can be addressed by considering theoptical system to have two optical stops, one on either side of thediffracting element. One of these stops can be used to block unwantedbackground radiation while the other one can by sized appropriately tocapture a larger amount of the diffracted scene radiation that wouldordinarily be lost.

Reference is made to FIG. 1, which is a schematic view of an imagingspectrometer system 100 taken along its optical axes 10 and 15. Inoperation, electromagnetic radiation, typically in the ultraviolet,visible, and/or infrared bands, hereinafter referred to generally aslight, emitted or reflected by a given object, either real or virtual,hereinafter referred to generally as the source (not shown), is incidentonto an optical imaging system 20, in this embodiment made up of, butnot limited to, four refractive elements 21, 22, 23, and 24, and arefractive window 25, which is capable of substantially receiving aportion of the light from the source. The light is then substantiallyfocused onto a focus position (hereinafter also referred to as an imageplane, which is typically planar, but without loss of generality mayalso be a curved or other non-planar surface) of a sampling aperture,typically a slit or other method of extracting a line image,(hereinafter also referred to as a slit element, but without loss ofgenerality may be any form of sampling aperture, either reflective,refractive, open, or other type of architecture) 30, which is capable ofsubstantially receiving the light from the optical imaging system 20.

Light transmitted by the slit element 30 is substantially collimatedthrough a first portion of an optical spectrometer system 40, in thisembodiment made up of, but not limited to, four refractive elements 41,42, 43, and 44, onto a refractive dispersing element or any method ofangularly separating light energy according to its wavelength,hereinafter referred to generally as a dispersing element 45, which isoptically disposed substantially proximate to an optical stop 50 and issubstantially capable of receiving a portion of the light from the firstportion of the optical spectrometer 40. This dispersed light is thensubstantially imaged by a second portion of the optical spectrometersystem 40, in this embodiment made up of, but not limited to, fourrefractive elements 46, 47, 48, and 49, onto a CCD array, phosphorescentscreen, photographic film, microbolometer array, or other means ofdetecting light energy, hereinafter referred to generally as a detectingelement 70, which is substantially capable of receiving a portion of thelight from the second portion of the optical spectrometer system 40.

Reference is made to FIG. 2, which is a schematic view of the slitelement 30 of the imaging spectrometer system 100 illustrated in FIG. 1,and illustrates the diffraction of light passing through the slitaperture (described in Eugene Hecht, “Optics”, second Edition,Addison-Wesley Publishing Company, Reading, M A, 1987, pp. 401-406)Light transmitted by the slit element 30 undergoes diffractionsubstantially according to the mathematical sinc( )² function, causingthe transmitted light to diverge away from the incident beam trajectoryas it passes through the slit element 30.

Reference is made to FIG. 3, which is a schematic view of the imagingspectrometer system 100 taken along its optical axes 10 and 15. Inoperation, light emitted or reflected by the source (not shown), isincident onto the optical imaging system 20, in this embodiment made upof, but not limited to, four refractive elements 21, 22, 23, and 24, anda refractive window 25, which is capable of substantially receiving aportion of the light from the source. The light is then substantiallyfocused onto the slit element 30, which is capable of substantiallyreceiving the light from the optical imaging system 20. Lighttransmitted by the slit element 30 is substantially diffracted by slitelement 30 and collimated through a first portion of an opticalspectrometer system 40, in this embodiment made up of, but not limitedto, four refractive elements 41, 42, 43, and 44, onto a dispersingelement 45, which is optically disposed substantially proximate to anoptical stop 50 and is substantially capable of receiving a portion ofthe light from the first portion of the optical spectrometer 40. A firstportion of the diffracted collimated light 71 is substantiallytransmitted by the optical stop 50, and is then substantially imaged bya second portion of the optical spectrometer system 40, in thisembodiment made up of, but not limited to, four refractive elements 46,47, 48, and 49, onto a detecting element 60, which is substantiallycapable of receiving a portion of the light from the second portion ofthe optical spectrometer system 40. A second portion of the diffractedcollimated light 72 is substantially blocked by the optical stop 50 andis substantially not imaged by the second portion of the opticalspectrometer system 40 onto the detecting element 60. This blockedsecond portion of the light results in a loss in the total throughput ofthe imaging spectrometer system 100 substantially due to the diffractionof the light at the slit element 30.

Reference is made to FIG. 4, which is a schematic view of an embodimentof the present teachings 200 taken along its optical axes 10 and 15. Inoperation, light emitted or reflected by the source (not shown), isincident onto the optical imaging system 20, in this embodiment made upof, but not limited to, four refractive elements 21, 22, 23, and 24, anda refractive window 25, which is capable of substantially receiving aportion of the light from the source. The light is then substantiallyfocused onto the slit element 30, which is capable of substantiallyreceiving the light from the optical imaging system 20. Lighttransmitted by the slit element 30 is substantially diffracted by slitelement 30 and collimated through a first portion of an opticalspectrometer system 240, in this embodiment made up of, but not limitedto, four refractive elements 241, 242, 243, and 244, onto a dispersingelement 245, which is optically disposed substantially proximate to anoptical stop 250 and is substantially capable of receiving a portion ofthe light from the first portion of the optical spectrometer 240. Theoptical stop 250 is substantially oversized relative to the opticalspeed of the optical imaging system 20, such that a substantial portionof the diffracted collimated light 270 is substantially transmitted bythe optical stop 250, and is then substantially imaged by a secondportion of the optical spectrometer system 240, in this embodiment madeup of, but not limited to, four refractive elements 246, 247, 248, and249, onto a detecting element 60, which is substantially capable ofreceiving a portion of the light from the second portion of the opticalspectrometer system 240. The optical elements of the opticalspectrometer 240, in this embodiment made up of, but not limited to,refractive elements 241, 242, 243, 244, 246, 247, 248, and 249 are sizedappropriately to substantially transmit the portion of the diffractedlight 270 that is substantially transmitted by the optical stop 250.This substantially larger transmitted portion of the diffracted light270 results in an increase in the total throughput of the imagingspectrometer system 100 that would otherwise be lost due to diffractionof the light at the slit element 30.

Reference is made to FIG. 5, which is a schematic view of the imagingspectrometer system 100 taken along its optical axes 10 and 15. Inoperation, unwanted light 75 may be substantially directed towards theslit element 30, which is capable of substantially receiving theunwanted light. A portion of this unwanted light transmitted by the slitelement 30 is substantially diffracted by slit element 30 and collimatedthrough a first portion of an optical spectrometer system 40, in thisembodiment made up of, but not limited to, four refractive elements 41,42, 43, and 44, onto a dispersing element 45, which is opticallydisposed substantially proximate to an optical stop 50 and issubstantially capable of receiving a portion of the light from the firstportion of the optical spectrometer 40. A first portion of thediffracted collimated light 76 is substantially transmitted by theoptical stop 50, and is then substantially imaged by a second portion ofthe optical spectrometer system 40, in this embodiment made up of, butnot limited to, four refractive elements 46, 47, 48, and 49, onto adetecting element 60, which is substantially capable of receiving aportion of the light from the second portion of the optical spectrometersystem 40. This transmitted first portion of the light results in anincrease in the unwanted background radiation in the imagingspectrometer system 100 substantially due to the diffraction of theunwanted light 75 at the slit element 30. A second portion of thediffracted collimated light 77 is substantially blocked by the opticalstop 50 and is substantially not imaged by the second portion of theoptical spectrometer system 40 onto the detecting element 60.

Reference is made to FIG. 6, which is a schematic view of an embodimentof the present teachings 300 taken along its optical axes 10 and 15. Inoperation, light emitted or reflected by the source (not shown), isincident onto the optical imaging system 320, in this embodiment made upof, but not limited to, four refractive elements 321, 322, 323, and 324,and a refractive window 325, which is capable of substantially receivinga first portion of the light from the source. This first portion of thelight is then substantially focused onto the slit element 30, which iscapable of substantially receiving the light from the optical imagingsystem 20. Light transmitted by the slit element 30 is substantiallydiffracted by slit element 30 and collimated through a first portion ofan optical spectrometer system 40, in this embodiment made up of, butnot limited to, four refractive elements 41, 42, 43, and 44, onto adispersing element 45, which is optically disposed substantiallyproximate to an optical stop 50 and is substantially capable ofreceiving a portion of the light from the first portion of the opticalspectrometer 40. The optical elements of the optical imaging system 320,in this embodiment made up of, but not limited to, refractive elements321, 322, 323, 324, and refractive window 325, are sized appropriatelyto substantially transmit a second portion of the light 372 from thesource that would normally be substantially blocked by the optical stop50. A portion of the light 372 from the source that is substantiallydiffracted 371 by the slit element 30 is substantially transmitted bythe optical stop 50, and is then substantially imaged by a secondportion of the optical spectrometer system 40, in this embodiment madeup of, but not limited to, four refractive elements 46, 47, 48, and 49,onto a detecting element 60, which is substantially capable of receivinga portion of the light from the second portion of the opticalspectrometer system 40. This transmitted portion 371 of the diffractedlight from the second portion of the light 372 from the source resultsin an increase in the total throughput of the imaging spectrometersystem 100 that would otherwise not be transmitted by the opticalspectrometer system 40.

Reference is made to FIG. 7, which is a schematic view of the imagingspectrometer system 400 taken along its optical axes, and is comprisedof the imaging spectrometer system 300 illustrated previously in FIG. 6.In operation, light emitted or reflected by the source (not shown), isincident onto the optical imaging system 410, which is capable ofsubstantially receiving a portion of the light from the source andcapable of substantially transmitting a portion of the light to theimaging spectrometer system 300. Unwanted light 370 directed from anynumber of sources, including but not limited to the housings of theimaging optical system 400, other mechanical structures, or othersources, hereinafter referred to generally as unwanted sources, may besubstantially directed towards the imaging spectrometer system 300,which is capable of substantially receiving the unwanted light. Asdescribed previously, a portion of this unwanted light transmitted bythe imaging spectrometer system 300 may be substantially diffracted andsubstantially imaged onto its detecting element. This transmittedportion 370 of the light results in an increase in the unwantedbackground radiation in the imaging spectrometer system 400substantially due to the diffraction of the unwanted light within theimaging spectrometer system 300.

Reference is made to FIG. 9, which is a schematic view of an embodimentof the present teachings 500 taken along its optical axes 10 and 15. Inoperation, light emitted or reflected by the source (not shown), isincident onto the optical imaging system 520, in this embodiment made upof, but not limited to, four refractive elements 521, 522, 523, and 524,which is capable of substantially receiving a portion of the light fromthe source. This light is then substantially focused through anenvironmental window, including but not limited to, any element thatseparates one environment from another, in this embodiment made up of arefractive window 525, and onto a slit element 30, which is capable ofsubstantially receiving the light from the optical imaging system 520.An optical aperture capable of substantially transmitting a portion ofthe light from the source and substantially capable of blocking unwantedlight from any number of other sources, such as but not limited to anoptical stop element, reflective shield, or other aperture, hereinafterreferred to generally as a shield element, 580, in this embodiment madeup of a reflective aperture, is substantially located near an entranceor exit pupil or optical stop of the optical imaging system 520, in thisembodiment located near the entrance pupil of the optical imaging system520. Light emitted or reflected by the shield element 580 issubstantially transmitted by the optical imaging system 520, which iscapable of substantially receiving a portion of the light from theshield element 580 and then substantially focusing the light through theenvironmental window 525 and onto the slit element 30. A first portionof the light 371 from the shield element is transmitted by the slitelement 30 and is substantially diffracted by slit element 30 and imagedby the optical spectrometer system 40 onto a detecting element 60, whichis substantially capable of receiving a portion of the light from theoptical spectrometer system 40. The shield element 580 is configured toemit or reflect substantially low amounts of light relative to the anynumber of other sources, which can be accomplished by a number of means,including but not limited to, a highly emissive or dark surface forvisible wavelength applications, or a substantially cold surface forthermal wavelength applications. In this embodiment, the slit element30, optical spectrometer system 40, and detecting element 60 are locatedwithin a substantially lower temperature environment, including but notlimited those produced by cryogenic coolers, in this embodimentconsisting of the cryogenic environment of a Dewar 590 such that theradiative emissions of these elements are substantially small. Thesurface of the shield element 580 is substantially reflective and isoptically disposed to reflect radiation emitted from these elementssubstantially back towards themselves. In this manner, unwanted lightfrom outside the imaging spectrometer system 500 is blocked by theshield element 580, which only reflects substantially low radiationemitted by the contents of the cryogenic environment of the Dewar 590.As a result, the unwanted background radiation that would otherwise bediffracted by the slit element 30 is substantially reduced. Thisunwanted background radiation or unwanted light from the any number ofother sources may include radiation emitted or reflected by any numberof objects including, but not limited to, optical or mechanical housingsor structures, electronic circuit cards, heat sinks or power supplies,etc., and in general may be any object that emits or reflects radiationother than the light from the intended scene.

Reference is made to FIG. 9, which is a schematic view of an embodimentof the present teachings 600 taken along its optical axes 10 and 15. Inoperation, light emitted or reflected by the source (not shown), isincident onto the optical imaging system 520, in this embodiment made upof, but not limited to, four refractive elements 521, 522, 523, and 524,which is capable of substantially receiving a portion of the light fromthe source. This light is then substantially focused through anenvironmental window, in this embodiment made up of, but not limited to,a refractive window 525, and onto a slit element 30, which is capable ofsubstantially receiving the light from the optical imaging system 520. Ashield element, 680, in this embodiment made up of an absorptive, orhigh-emissivity, aperture, is substantially located near the slitelement 30 and optically disposed prior to the slit element 30. Aportion of the light 675 emitted or reflected by the shield element 580is substantially transmitted by the slit element 30 and is substantiallydiffracted by slit element 30 and imaged by the optical spectrometersystem 40 onto a detecting element 60, which is substantially capable ofreceiving a portion of the light from the optical spectrometer system40. In this embodiment, the shield element 680, slit element 30, opticalspectrometer system 40, and detecting element 60 are located within acryogenic environment of a Dewar 590 such that the radiative emissionsof these elements are substantially small. The surface of the shieldelement 580 is optically disposed to emit radiation substantiallytowards the slit element 30. In this manner, unwanted light from outsidethe imaging spectrometer system 600 is blocked by the shield element580, which only emits substantially low radiation due to the cryogenicenvironment of the Dewar 590. As a result, the unwanted backgroundradiation that would otherwise be diffracted by the slit element 30 issubstantially reduced.

Reference is made to FIG. 10, which is a schematic view of an embodimentof the present teachings 700 taken along its optical axes 10 and 15. Inoperation, light emitted or reflected by the source (not shown), isincident onto an environmental window, in this embodiment made up of,but not limited to, a refractive window 725, which is capable ofsubstantially receiving a portion of the light from the source. Thelight is then incident onto an optical imaging system 720, in thisembodiment made up of, but not limited to, four refractive elements 721,722, 723, and 724, which is capable of substantially receiving a portionof the light from the environmental window 725. This light is thensubstantially focused onto a slit element 30, which is capable ofsubstantially receiving the light from the optical imaging system 720. Ashield element, 780, in this embodiment made up of an absorptive, orhigh emissivity aperture, is substantially located near an entrance orexit pupil or optical stop of the optical imaging system 720, in thisembodiment located near the entrance pupil of the imaging system 720.Light emitted or reflected by the shield element 780 is substantiallytransmitted by the optical imaging system 720, which is capable ofsubstantially receiving a portion of the light from the shield element780 and then substantially focusing the light onto the slit element 30.A first portion of the light 371 from the shield element is transmittedby the slit element 30 and is substantially diffracted by slit element30 and imaged by the optical spectrometer system 40 onto a detectingelement 60, which is substantially capable of receiving a portion of thelight from the optical spectrometer system 40. In this embodiment, theshield element 780, optical imaging system 720, slit element 30, opticalspectrometer system 40, and detecting element 60 are located within acryogenic environment of a Dewar 790 such that the radiative emissionsof these elements are substantially small. The surface of the shieldelement 780 is optically disposed to emit radiation 370 substantiallytowards the optical imaging system 720, which is capable ofsubstantially receiving a portion of the radiation from the shieldelement 780 and substantially focusing the radiation onto the slitelement 30. In this manner, unwanted light from outside the imagingspectrometer system 700 is blocked by the shield element 780, which onlyemits substantially low radiation due to the cryogenic environment ofthe Dewar 790. As a result, the unwanted background radiation that wouldotherwise be diffracted by the slit element 30 is substantially reduced.

Reference is made to FIG. 11, which is a schematic view of an embodimentof the present teachings 800 taken along its optical axes 10 and 15. Inoperation, light emitted or reflected by the source (not shown), isincident onto an environmental window, in this embodiment made up of,but not limited to, a refractive window 725, which is capable ofsubstantially receiving a portion of the light from the source. Thelight is then incident onto an optical imaging system 720, in thisembodiment made up of, but not limited to, four refractive elements 721,722, 723, and 724, which is capable of substantially receiving a portionof the light from the environmental window 725. This light is thensubstantially focused onto a slit element 30, which is capable ofsubstantially receiving the light from the optical imaging system 720.Light transmitted by the slit element 30 is substantially diffracted byslit element 30 and imaged by the optical spectrometer system 40 onto adetecting element 60, which is substantially capable of receiving aportion of the light from the optical spectrometer system 240. Theoptical stop element 250 of the optical spectrometer system 240 issubstantially oversized relative to the optical speed of the opticalimaging system 720, such that a substantial portion of the diffractedcollimated light 270 is substantially transmitted by the optical stop250, and is then substantially imaged by the optical spectrometer system240 onto the detecting element 60, which is substantially capable ofreceiving a portion of the light from the optical spectrometer system240. The optical elements of the optical spectrometer 240 are sizedappropriately to substantially transmit the portion of the diffractedlight 270 that is substantially transmitted by the optical stop 250.This substantially larger transmitted portion of the diffracted light270 results in an increase in the total throughput of the imagingspectrometer system 800 that would otherwise be lost due to diffractionof the light at the slit element 30.

Reference is made to FIG. 12, which is a schematic view of an embodimentof the present teachings 900 taken along its optical axes 10 and 15. Inoperation, light emitted or reflected by the source (not shown), isincident onto the optical imaging system 920, in this embodiment made upof, but not limited to, four refractive elements 921, 922, 923, and 924,which is capable of substantially receiving a portion of the light fromthe source. This light is then substantially focused through anenvironmental window, including but not limited to, any element thatseparates one environment from another, in this embodiment made up of arefractive window 525, and onto a slit element 30, which is capable ofsubstantially receiving the light from the optical imaging system 920. Afirst optical aperture capable of substantially transmitting a portionof the light from the source and substantially capable of blockingunwanted light from any number of other sources, such as but not limitedto an optical stop element, reflective shield, or other aperture,hereinafter referred to generally as a first shield element, 980, inthis embodiment made up of a reflective aperture, is substantiallylocated near an entrance or exit pupil or optical stop of the opticalimaging system 920, in this embodiment located near the entrance pupilof the optical imaging system 920. Light emitted or reflected by thefirst shield element 980 is substantially transmitted by the opticalimaging system 920, which is capable of substantially receiving aportion of the light from the shield element 980 and then substantiallyfocusing the light through the environmental window 525 and onto theslit element 30. A first portion of the light 970 from the first shieldelement 980 is transmitted by the slit element 30 and is substantiallydiffracted by slit element 30 and imaged by the optical spectrometersystem 40 onto a detecting element 60, which is substantially capable ofreceiving a portion of the light from the optical spectrometer system40. The first shield element 980 is configured to emit or reflectsubstantially low amounts of light relative to the any number of othersources, which can be accomplished by a number of means, including butnot limited to, a highly emissive or dark surface for visible wavelengthapplications, or a substantially cold surface for thermal wavelengthapplications. In this embodiment, the slit element 30, opticalspectrometer system 40, and detecting element 60 are located within asubstantially lower temperature environment, including but not limitedthose produced by cryogenic coolers, in this embodiment consisting ofthe cryogenic environment of a Dewar 590 such that the radiativeemissions of these elements are substantially small. The surface of thefirst shield element 980 is substantially reflective and is opticallydisposed to reflect radiation emitted from these elements substantiallyback towards themselves. In this manner, unwanted light from outside theimaging spectrometer system 900 is blocked by the first shield element980, which only reflects substantially low radiation emitted by thecontents of the cryogenic environment of the Dewar 590. As a result, theunwanted background radiation that would otherwise be diffracted by theslit element 30 is substantially reduced. This unwanted backgroundradiation or unwanted light from the any number of other sources mayinclude radiation emitted or reflected by any number of objectsincluding, but not limited to, optical or mechanical housings orstructures, electronic circuit cards, heat sinks or power supplies,etc., and in general may be any object that emits or reflects radiationother than the light from the intended scene.

A second shield element, 985, in this embodiment made up of anabsorptive, or high-emissivity, aperture, is substantially located nearthe slit element 30 and optically disposed prior to the slit element 30.A portion of the light 975 emitted or reflected by the second shieldelement 985 is substantially transmitted by the slit element 30 and issubstantially diffracted by slit element 30 and imaged by the opticalspectrometer system 40 onto a detecting element 60, which issubstantially capable of receiving a portion of the light from theoptical spectrometer system 40. The surface of the second shield element985 is optically disposed to emit radiation substantially towards theslit element 30. In this manner, unwanted light from outside the imagingspectrometer system 900 is blocked by the second shield element 985,which only emits substantially low radiation due to the cryogenicenvironment of the Dewar 590. As a result, the unwanted backgroundradiation that would otherwise be diffracted by the slit element 30 issubstantially reduced. The unwanted light that is blocked by the secondshield element 985 reduces the amount of unwanted background radiationthat the first shield element 980 would otherwise be required to blockin order to achieve a similar reduction in unwanted background radiationif the second shield element were not present, thereby reducing therequired size of the first shield element 980. This allows for one ormore of the optical elements 921, 922, 923, and 924 of the opticalimaging system 920 to potentially be reduced, thereby reducing theoverall size and weight of the system.

Reference is made to FIG. 13, which is a schematic view of an embodimentof the present teachings 1000 taken along its optical axes 1010 and1015. In operation, light emitted or reflected by the source (notshown), is incident onto the optical imaging system 1020, in thisembodiment made up of, but not limited to, four, refractive elements1021, 1022, 1023, and 1024, which is capable of substantially receivinga portion of the light 1090 from the source. This light is thensubstantially focused through an environmental window, including but notlimited to, any element that separates one environment from another, inthis embodiment made up of a refractive window 525, and onto a slitelement 30, which is capable of substantially receiving the light fromthe optical imaging system 1020. A number of optical apertures capableof substantially transmitting a portion of the light from the source andsubstantially capable of blocking unwanted light from any number ofother sources, such as but not limited to an optical stop element,reflective shield, or other aperture, hereinafter referred to generallyas shield elements, in this embodiment made up of an absorptive, orhigh-emissivity, aperture 1080 substantially located near the slitelement 1030 and optically disposed prior to the slit element 1030, andthree reflective apertures 1081, 1082, and 1883, optically disposedbehind optical elements 1021, 1022, and 1024 respectively of the opticalimaging system 920. Light emitted or reflected by each of the shieldelements 1080, 1081, 1082, and 1083 is substantially transmitted by theoptical elements of imaging system 920 that are optically disposedbetween each shield and the slit aperture 1030, which are capable ofsubstantially receiving a portion of the light from the number of shieldelements 1080, 1081, 1082, and 1083, and then substantially focusing thelight through the environmental window 525 and onto the slit element 30.In this embodiment, the shield element 1080, slit element 1030, opticalspectrometer system 1040, and detecting element 1060 are located withina cryogenic environment of a Dewar 1090 such that the radiativeemissions of these elements are substantially small. The surface of theshield element 1080 is optically disposed to emit radiationsubstantially towards the slit element 1030. A first portion of thelight 1070 from the shield element 1080 is transmitted by the slitelement 1030 and is substantially diffracted by slit element 1030 andimaged by the optical spectrometer system 1040 onto a detecting element1060, which is substantially capable of receiving a portion of the lightfrom the optical spectrometer system 1040. The shield element 1081 isconfigured to emit or reflect substantially low amounts of lightrelative to the any number of other sources, which can be accomplishedby a number of means, including but not limited to, a highly emissive ordark surface for visible wavelength applications, or a substantiallycold surface for thermal wavelength applications. In this embodiment,the surface of the shield element 1081 is substantially reflective andis optically disposed to reflect radiation 1071 emitted from theelements located within the cryogenic space of the Dewar 1090substantially back towards themselves. In this manner, a portion of theunwanted light from outside the imaging spectrometer system 1000 that isnot blocked by the shield element 1080 is blocked by the shield element1081, which reflects substantially low radiation emitted by the contentsof the cryogenic environment of the Dewar 1090. Shield element 1082 issimilarly configured to emit or reflect substantially low amounts oflight relative to the any number of other sources, and in thisembodiment, the surface of the shield element 1082 is substantiallyreflective and is optically disposed to reflect radiation 1072 emittedfrom the elements located within the cryogenic space of the Dewar 1090substantially back towards themselves. In this manner, a portion of theunwanted light from outside the imaging spectrometer system 1000 that isnot blocked by the shield elements 1080 and 1081 is blocked by theshield element 1082, which reflects substantially low radiation 1073emitted by the contents of the cryogenic environment of the Dewar 1090.Shield element 1083 is similarly configured to emit or reflectsubstantially low amounts of light relative to the any number of othersources, and in this embodiment, the surface of the shield element 1083is substantially reflective and is optically disposed to reflectradiation emitted from the elements located within the cryogenic spaceof the Dewar 1090 substantially back towards themselves. In this manner,a portion of the unwanted light from outside the imaging spectrometersystem 1000 that is not blocked by the shield elements 1080, 1081, and1082 is blocked by the shield element 1083, which reflects substantiallylow radiation emitted by the contents of the cryogenic environment ofthe Dewar 1090. As a result, the unwanted background radiation thatwould otherwise be diffracted by the slit element 1030 is substantiallyreduced. The unwanted light that is blocked by the each of the shieldelements 1080, 1081, and 1082 respectively reduces the amount ofunwanted background radiation that each of the shield elements 1081,1082, and 1083 would otherwise be required to block in order to achievea similar reduction in unwanted background radiation if each of thoseshield elements were not present, thereby reducing the required size ofthe shield elements 1081, 1082, and 1083. This allows for one or more ofthe optical elements 1021, 1022, 1023, and 1024 of the optical imagingsystem 1020 to potentially be reduced, thereby reducing the overall sizeand weight of the system.

Reference is made to FIG. 14A, which is an isometric view of the opticalimaging system 1020 of the embodiment of the present teachings 1000taken from the front direction and illustrates the relative locations ofthe shield elements 1081, 1082, and 1083 with respect to the opticalelements 1021, 1022, 1023, and 1024. Similar reference is made to FIG.14B, which is an isometric view of the optical imaging system 1020 ofthe embodiment of the present teachings 1000 taken from the backdirection and further illustrates the relative locations of the shieldelements 1081, 1082, and 1083 with respect to the optical elements 1021,1022, 1023, and 1024. This view also illustrates the various aperturesof the shield elements 1081, 1082, and 1083 which include both circularand elliptical apertures, but in practice can be any shape aperture,such as but not limited to square, rectangular, polygon, free-form, orother shapes.

Reference is made to FIGS. 15A-F, which are views of the shield elements1081, 1082, and 1083 of the embodiment of the present teachings 1000taken from the back direction. FIG. 15A illustrates the beam footprintsof the light 1090 from the source that is transmitted by the shieldelement 1083, while FIG. 15B illustrates the beam footprints of thelight 1073 that is emitted by the contents of the cryogenic environmentof the Dewar 1090 and reflected back towards themselves by the shieldelement 1083. Similarly, FIG. 15C illustrates the beam footprints of thelight 1090 from the source that is transmitted by the shield element1082, while FIG. 15D illustrates the beam footprints of the light 1072that is emitted by the contents of the cryogenic environment of theDewar 1090 and reflected back towards themselves by the shield element1082. Similarly, FIG. 15E illustrates the beam footprints of the light1090 from the source that is transmitted by the shield element 1081,while FIG. 15F illustrates the beam footprints of the light 1071 that isemitted by the contents of the cryogenic environment of the Dewar 1090and reflected back towards themselves by the shield element 1081.

For the purposes of describing and defining the present teachings, it isnoted that the term “substantially” is utilized herein to represent theinherent degree of uncertainty that may be attributed to anyquantitative comparison, value, measurement, or other representation.The term “substantially” is also utilized herein to represent the degreeby which a quantitative representation may vary from a stated referencewithout resulting in a change in the basic function of the subjectmatter at issue.

Although the teachings have been described with respect to variousembodiments, it should be realized these teachings are also capable of awide variety of further and other embodiments within the spirit andscope of the teachings. For example, although the shield element islocated in a number of positions in the embodiments shown, it should benoted that the specific location of the shield element is not limited tothese locations, but can in general be located anywhere, and in multiplelocations, within the embodiment. Additionally, although the embodimentsshown include imaging spectrometer systems, the teachings is not limitedonly to imaging spectrometer systems, but to any number of systems wherethe effects of diffraction exist, including by not limited to systemscontaining slits or substantially narrow apertures. Furthermore, anynumber of optical elements, reflective or refractive, can be used in theembodiments of the present teachings, and any aspects of the embodimentsof the present teachings, including but not limited to those shown, canbe used in combination with one another as still further embodiments.For example, an embodiment consisting of a shield element can becombined with an embodiment consisting of an oversized optical stop orwith an embodiment consisting of an optical imaging system withoversized optical elements. In other examples, the teachings can also beapplied to other refractive or reflective imaging or spectrometerdesigns, including but not limited to, Offner or Dyson relay andspectrometer designs.

What is claimed is:
 1. An optical imaging system comprising: a firstimaging optical sub-system having at least one optical element; saidfirst imaging optical sub-system being optically disposed to receivelight from a first source; a first shield element; said first shieldelement being optically disposed to block light from a second source;said first shield element being configured to emit or reflect lowamounts of light relative to said second source; a second shieldelement; said second shield element being optically disposed to blocklight from said second source; said second shield element beingconfigured to emit or reflect low amounts of light relative to saidsecond source; said first imaging optical sub-system being configured tosubstantially focus a portion of said light onto a slit element; saidslit element being optically disposed to receive a portion of saidlight; an aperture of said slit element being configured tosubstantially diffract said light; a second imaging optical sub-systemhaving at least one optical element; said second imaging opticalsub-system being optically disposed to receive a portion of diffractedlight from said slit element; said second imaging optical sub-systembeing configured to substantially focus a portion of said diffractedlight to an image plane; and said image plane being optically disposedto receive a portion of said diffracted light.
 2. The optical imagingsystem of claim 1 wherein at least one optical element is one of arefractive element or a reflective element.
 3. The optical imagingsystem of claim 1 wherein said second imaging sub-system is aspectrometer.
 4. The optical imaging system of claim 1 wherein saidfirst shield element is one of substantially reflective or substantiallyemissive.
 5. The optical imaging system of claim 1 wherein said firstshield element is optically disposed between said first source and saidfirst imaging optical sub-system and said first optical sub-system isconfigured to receive a portion of said light from said first shieldelement.
 6. The optical imaging system of claim 5 further comprising: aDewar; said Dewar being configured to provide a cryogenic environment.7. The optical imaging system of claim 6 wherein said first shieldelement is substantially reflective; said first shield element beingconfigured to substantially reflect light emitted by said cryogenicenvironment to said first optical imaging sub-system.
 8. The opticalimaging system of claim 6 wherein said shield element is substantiallyemissive; said first shield element being optically disposed within saidcryogenic environment.
 9. The optical imaging system of claim 1 whereinsaid first shield element is optically disposed between said firstimaging optical sub-system and said slit element.
 10. The opticalimaging system of claim 9 further comprising: a Dewar; said Dewar beingconfigured to provide a cryogenic environment.
 11. The optical imagingsystem of claim 10 wherein said shield element is substantiallyreflective; said first shield element being configured to substantiallyreflect light emitted by said cryogenic environment to said firstoptical imaging sub-system.
 12. The optical imaging system of claim 10wherein said first shield element is substantially emissive; said firstshield element being optically disposed within said cryogenicenvironment.
 13. The optical imaging system of claim 1 wherein saidsecond imaging optical sub-system has an optical stop configured toprovide a second optical speed that is substantially larger than a firstoptical speed of said first optical sub-system.
 14. The optical imagingsystem of claim 13 further comprising: a Dewar; said Dewar beingconfigured to provide a cryogenic environment.
 15. The optical imagingsystem of claim 14 wherein said first shield element is substantiallyreflective; said first shield element being configured to substantiallyreflect light emitted by said cryogenic environment to said firstoptical imaging sub-system.
 16. The optical imaging system of claim 14wherein said first shield element is substantially emissive; said firstshield element, said first optical sub-system, and said second opticalsub-system being optically disposed within said cryogenic environment.17. An optical imaging system comprising: a first imaging opticalsub-system having at least one optical element; said first imagingoptical sub-system being optically disposed to receive light from afirst source; a plurality of shield elements; each shield element insaid plurality of shield elements being optically disposed to blocklight from a second source; each shield element in said plurality ofshield elements being configured to emit or reflect low amounts of lightrelative to said second source; said first imaging optical sub-systembeing configured to substantially focus a portion of said light onto aslit element; said slit element being optically disposed to receive aportion of said light; an aperture of said slit element being configuredto substantially diffract said light; a second imaging opticalsub-system having at least one optical element; said second imagingoptical sub-system being optically disposed to receive a portion ofdiffracted light from said slit element; said second optical sub-systembeing configured to substantially focus a portion of said diffractedlight to an image plane; and said image plane being optically disposedto receive a portion of said diffracted light.
 18. The optical imagingsystem of claim 17 wherein at least one shield element in said pluralityof shield elements is one of substantially reflective or substantiallyemissive.
 19. The optical imaging system of claim 17 wherein said secondimaging sub-system is a spectrometer.
 20. The optical imaging system ofclaim 17 wherein at least one shield element in said plurality of shieldelements is one of substantially reflective or substantially emissive.21. The optical imaging system of claim 17 wherein at least one shieldelement in said plurality of shield elements is optically disposedbetween said first source and said first imaging optical sub-system andsaid first optical sub-system is configured to receive a portion of saidlight from said at least one shield element in said plurality of shieldelements.
 22. The optical imaging system of claim 21 further comprising:a Dewar; said Dewar being configured to provide a cryogenic environment.23. The optical imaging system of claim 22 wherein said at least oneshield element in said plurality of shield elements is substantiallyreflective; said at least one shield element in said plurality of shieldelements being configured to substantially reflect light emitted by saidcryogenic environment to said first optical imaging sub-system.
 24. Theoptical imaging system of claim 22 wherein said least one shield elementin said plurality of shield elements is substantially emissive; said atleast one shield element in said plurality of shield elements beingoptically disposed within said cryogenic environment.
 25. The opticalimaging system of claim 17 wherein at least one shield element in saidplurality of shield elements is optically disposed between said firstimaging optical sub-system and said slit element.
 26. The opticalimaging system of claim 25 further comprising: a Dewar; said Dewar beingconfigured to provide a cryogenic environment.
 27. The optical imagingsystem of claim 26 wherein said at least one shield element in saidplurality of shield elements is substantially reflective; said at leastone shield element in said plurality of shield elements being configuredto substantially reflect light emitted by said cryogenic environment tosaid first optical imaging sub-system.
 28. The optical imaging system ofclaim 26 wherein said at least one shield element in said plurality ofshield elements is substantially emissive; said at least one shieldelement in said plurality of shield elements being optically disposedwithin said cryogenic environment.
 29. The optical imaging system ofclaim 17 wherein said second imaging optical sub-system has an opticalstop configured to provide a second optical speed that is substantiallylarger than a first optical speed of said first optical sub-system. 30.The optical imaging system of claim 29 further comprising: a Dewar; saidDewar being configured to provide a cryogenic environment.
 31. Theoptical imaging system of claim 30 wherein at least one shield elementin said plurality of shield elements is substantially reflective; saidat least one shield element in said plurality of shield elements beingconfigured to substantially reflect light emitted by said cryogenicenvironment to said first optical imaging sub-system.
 32. The opticalimaging system of claim 30 wherein said at least one shield element insaid plurality of shield elements is substantially emissive; said atleast one shield element in said plurality of shield elements, saidfirst optical sub-system, and said second optical sub-system beingoptically disposed within said cryogenic environment.
 33. A method fordecreasing background radiation in sensors, the method comprising:imaging electromagnetic radiation emanating from a first source througha first optical sub-system; substantially blocking background radiationfrom a second source with a shield element; wherein said shield elementemits or reflects less background radiation than is blocked by saidshield element; configuring a slit element, the slit element beingconfigured to substantially diffract light; substantially imagingelectromagnetic radiation diffracted by said slit through a secondoptical sub-system; detecting the diffracted electromagnetic radiationwith a detecting element; wherein background radiation in a sensor isreduced, the sensor comprising the first and second optical sub-systems.34. The method of claim 33 wherein the second optical sub-system is aspectrometer.
 35. A method for decreasing background radiation insensors, the method comprising: imaging electromagnetic radiationemanating from a first source through a first optical sub-system;substantially blocking background radiation from a second source with aplurality of shield elements; wherein said plurality of shield elementsemits or reflects less background radiation than is blocked by saidplurality of shield elements; configuring a slit element, the slitelement being configured to substantially diffract light; substantiallyimaging electromagnetic radiation diffracted by said slit through asecond optical sub-system; detecting the diffracted electromagneticradiation with a detecting element; wherein background radiation in asensor is reduced, the sensor comprising the first and second opticalsub-systems.
 36. The method of claim 35 wherein the second opticalsub-system is a spectrometer.
 37. The method of claim 35 wherein theplurality of shield elements are configured to substantially reduce asize of the sensor.